The first round of negotiations for the India-Chile Comprehensive Economic Partnership Agreement (CEPA) concluded successfully in New Delhi, marking a major step towards enhancing bilateral economic cooperation. The negotiations began on May 26, following the signing of the Terms of Reference on May 8.
The opening ceremony was inaugurated by India’s Commerce Secretary, Sunil Barthwal, in the presence of the Ambassador of Chile to India, H.E. Juan Angulo.
During the inauguration, Barthwal emphasized that the CEPA would pave the way for a deeper economic partnership between India and Chile and contribute to the creation of strengthened global value chains.
The initiative follows the momentum generated during the State Visit of the President of Chile, H.E. Gabriel Boric Font, to India in April 2025, where both countries welcomed the launch of CEPA negotiations. President Boric described India as a priority partner for Chile and stressed the importance of developing strategies for enhanced and diversified trade.
Both Prime Minister Narendra Modi and President Boric expressed support for an agreement that is balanced, ambitious, comprehensive, and mutually beneficial, with the goal of achieving deeper economic integration between the two countries.
Over the course of the round, discussions were held across various thematic areas covering trade, services, investment, economic cooperation, and strategic sectors. The CEPA is envisioned to unlock the full potential of India-Chile trade and commercial ties, leading to increased employment, stronger bilateral trade, and sustained economic growth.
The two sides have agreed to continue engagement through intersessional virtual discussions to address outstanding matters ahead of the next round of negotiations, which is expected to take place in July or August 2025. Both countries reaffirmed their commitment to a constructive and consultative negotiation process that involves industry feedback and stakeholder participation, aiming to deliver a meaningful and impactful agreement.
